Handbook of Silicon Wafer Cleaning Technology, 3rd Edition

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results.

The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.

The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.

• Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits
• Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries
• Covers processes and equipment, as well as new materials and changes required for the surface conditioning process

Table of Contents

Part I Introduction And Overview
Chapter 1 – Overview And Evolution Of Silicon Wafer Cleaning Technology∗
Chapter 2 – Overview Of Wafer Contamination And Defectivity

Part II Wet-Chemical Processes
Chapter 3 – Particle Deposition And Adhesion
Chapter 4 – Aqueous Cleaning And Surface Conditioning Processes
Chapter 5 – Post-Cmp Cleaning

Part III Dry Cleaning Processes
Chapter 6 – Gas-Phase Wafer Cleaning Technology
Chapter 7 – Plasma Stripping, Cleaning, And Surface Conditioning
Chapter 8 – Cryogenic Aerosols And Supercritical Fluid Cleaning And Surface Conditioning∗

Part IV Analytical And Control Aspects
Chapter 9 – Surface Chemical Composition And Morphology
Chapter 10 – Metal Surface Chemical Composition And Morphology
Chapter 11 – Monitoring Of Chemicals And Water
Chapter 12 – Detection And Measurement Of Particulate Contaminants
Chapter 13 – Ultratrace Impurity Analysis Of Wafer Surfaces