Physical Design for 3D Integrated Circuits Front Cover

Physical Design for 3D Integrated Circuits

  • Length: 415 pages
  • Edition: 1
  • Publisher:
  • Publication Date: 2015-12-18
  • ISBN-10: 1498710360
  • ISBN-13: 9781498710367
  • Sales Rank: #4479646 (See Top 100 Books)
Description

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

  • Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
  • Supplies state-of-the-art solutions for challenges unique to 3D circuit design
  • Features contributions from renowned experts in their respective fields

Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Table of Contents

Section I – 3D Integration Overview
Chapter 1 – 2.5D/3D ICs: Drivers, Technology, Applications, and Outlook
Chapter 2 – Overview of Physical Design Issues for 3D-Integrated Circuits
Chapter 3 – Detailed Electrical and Reliability Study of Tapered TSVs
Chapter 4 – 3D Interconnect Extraction
Chapter 5 – 3D Placement and Routing
Chapter 6 – Power and Signal Integrity Challenges in 3D Systems-on-Chip
Chapter 7 – Design Methodology for TSV-Based 3D Clock Networks
Chapter 8 – Design Methodology for 3D Power Delivery Networks
Chapter 9 – Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits
Chapter 10 – Thermal Modeling and Management for 3D Stacked Systems
Chapter 11 – Exploration of the Thermal Design Space in 3D Integrated Circuits
Chapter 12 – Dynamic Thermal Optimization for 3D Many-Core Systems
Chapter 13 – TSV-to-Device Noise Analysis and Mitigation Techniques
Chapter 14 – Overview of 3D CAD Design Tools
Chapter 15 – Design Challenges and Solutions for Monolithic 3D ICs
Chapter 16 – Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs
Chapter 17 – Challenges and Future Directions of 3D Physical Design

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